Characterization of Interconnect Fault Effects in SRAM-based FPGAs

التفاصيل البيبلوغرافية
العنوان: Characterization of Interconnect Fault Effects in SRAM-based FPGAs
المؤلفون: Fibich, Christian, Horauer, Martin, Obermaisser, Roman
المصدر: 2023 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS) Design and Diagnostics of Electronic Circuits and Systems (DDECS), 2023 26th International Symposium on. :65-68 May, 2023
Relation: 2023 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350332773
تدمد:24732117
DOI:10.1109/DDECS57882.2023.10139343