مؤتمر
Hierarchically Porous Metal-organic Framework Composite for Heat Dissipation of Electronic Devices
| العنوان: | Hierarchically Porous Metal-organic Framework Composite for Heat Dissipation of Electronic Devices |
|---|---|
| المؤلفون: | Liu, Xiangyu, Jiang, Pingkai, Huang, Xingyi |
| المصدر: | 2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE) Electrical Materials and Power Equipment (ICEMPE), 2023 IEEE 4th International Conference on. :1-4 May, 2023 |
| Relation: | 2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350334678 9798350334661 |
|---|---|
| DOI: | 10.1109/ICEMPE57831.2023.10139360 |