التفاصيل البيبلوغرافية
العنوان: |
Development of 3-layer stacked global shutter CMOS image sensor with pixel pitch Cu-to-Cu interconnection and high-capacity capacitors |
المؤلفون: |
Oh, Seungjae, Kwon, Doowon, Lee, Haejung, Lim, Kyungtae, Kim, Taeyeong, Park, Jae-Hyung, Lee, Kyuha, Kim, Hyo Ju, Han, Yoonjay, Lee, Jae-Kyu, Moon, Chang-Rok, Song, Jaihyuk |
المصدر: |
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023 |
Relation: |
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) |
قاعدة البيانات: |
IEEE Xplore Digital Library |