مؤتمر
A Reliable Packaging Design for 1200-V, 500-A SiC Half-bridge Modules with Junction Temperature over 200 °C
| العنوان: | A Reliable Packaging Design for 1200-V, 500-A SiC Half-bridge Modules with Junction Temperature over 200 °C |
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| المؤلفون: | Wang, Jianing, Zhou, Weinan, Yu, Shaolin, Huang, Yaodong |
| المصدر: | 2023 IEEE 6th International Electrical and Energy Conference (CIEEC) Electrical and Energy Conference (CIEEC), 2023 IEEE 6th International. :2188-2193 May, 2023 |
| Relation: | 2023 IEEE 6th International Electrical and Energy Conference (CIEEC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350346671 |
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| DOI: | 10.1109/CIEEC58067.2023.10166115 |