A Modeling Method of SiC-MOSFET Short-circuit Failure Based on COMSOL Multiphysics and Simulink Co-simulation

التفاصيل البيبلوغرافية
العنوان: A Modeling Method of SiC-MOSFET Short-circuit Failure Based on COMSOL Multiphysics and Simulink Co-simulation
المؤلفون: Dou, Zhifeng, Tian, Ye, Yang, Yan, Song, Jiyan, Zheng, Anping, Zhang, Changai
المصدر: 2023 IEEE 6th International Electrical and Energy Conference (CIEEC) Electrical and Energy Conference (CIEEC), 2023 IEEE 6th International. :3664-3669 May, 2023
Relation: 2023 IEEE 6th International Electrical and Energy Conference (CIEEC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350346671
DOI:10.1109/CIEEC58067.2023.10166162