Investigation of the Influence of Dam and Fill Encapsulating Material Shrinkage on a Semiconductor Substrate Warpage

التفاصيل البيبلوغرافية
العنوان: Investigation of the Influence of Dam and Fill Encapsulating Material Shrinkage on a Semiconductor Substrate Warpage
المؤلفون: Otahal, Alexandr, Gablech, Imrich, Skacel, Josef, Szendiuch, Ivan
المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-5 May, 2023
Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350334845
تدمد:21612536
DOI:10.1109/ISSE57496.2023.10168456