دورية أكاديمية
Half-conductive coupling interconnection technology for digital transmission between CMOS chips
| العنوان: | Half-conductive coupling interconnection technology for digital transmission between CMOS chips |
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| المؤلفون: | Devisch, F., Maillard, X., Wei Pan, De Tandt, C., Vounckx, R., Kuijk, M. |
| المصدر: | IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 25(1):92-97 Feb, 2002 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213323 15579980 |
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| DOI: | 10.1109/TADVP.2002.1017690 |