دورية أكاديمية
Flexible Hybrid Electronics Including Ultrathin Strain Sensors or Radio Frequency Identification Dies Manufactured on Wafer Silicon Carrier
| العنوان: | Flexible Hybrid Electronics Including Ultrathin Strain Sensors or Radio Frequency Identification Dies Manufactured on Wafer Silicon Carrier |
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| المؤلفون: | Souriau, J., Poulain, C., Castagne, L., Ladner, C., Hilt, T., Franiatte, R., Mermin, D., David, N. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(7):913-919 Jul, 2023 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2023.3293528 |