التفاصيل البيبلوغرافية
| العنوان: |
Digital Twin in Manufacturing: Reflow Soldering Process |
| المؤلفون: |
Ameli, Alireza, Jutila, Henri, Huttunen, Jari, Markus, Sami, Milne, Matt, Cordell-Morris, Kelly |
| المصدر: |
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-5 May, 2023 |
| Relation: |
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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