التفاصيل البيبلوغرافية
| العنوان: |
A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5D/3D Integration |
| المؤلفون: |
Liao, Jie, Jiao, Bo, Zhang, Jinshan, Liu, Shiwei, Jiang, Hao, Tao, Jun, Jiang, Wenning, Liu, Qi, Zhang, Lihua, Zhu, Haozhe, Chen, Chixiao |
| المصدر: |
2023 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2023 IEEE International Symposium on. :1-5 May, 2023 |
| Relation: |
2023 IEEE International Symposium on Circuits and Systems (ISCAS) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
Full Text Finder