التفاصيل البيبلوغرافية
| العنوان: |
On the path to AI hardware via chiplet integration enabled by high density organic substrates |
| المؤلفون: |
Bonilla, Griselda, Quinlan, Brian, Wassick, Thomas, Kastberg, Russell, Li, Shidong, Basutkar, Monali |
| المصدر: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1374-1380 May, 2023 |
| Relation: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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