التفاصيل البيبلوغرافية
| العنوان: |
Development of 4 die stack module using Hybrid bonding approach |
| المؤلفون: |
Chong, Ser Choong, Keng Yuen, Jason Au, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Rao, Vempati Srinivasa |
| المصدر: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :788-794 May, 2023 |
| Relation: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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