مؤتمر
Thermal Solutions For Large Die and Package
| العنوان: | Thermal Solutions For Large Die and Package |
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| المؤلفون: | Chee, Choong Kooi, Hsu, Sean, Patel, Janak, Bamido, Alaba |
| المصدر: | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :929-934 May, 2023 |
| Relation: | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9798350334982 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC51909.2023.00159 |