Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers

التفاصيل البيبلوغرافية
العنوان:	Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers
المؤلفون:	Kennes, Koen, Guerrero, Alice, Salahouelhadj, Abdellah, Suhard, Samuel, Derakhshandeh, Jaber, Phommahaxay, Alain, Brems, Steven, Beyer, Gerald, Beyne, Eric
المصدر:	2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1584-1589 May, 2023
Relation:	2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library