التفاصيل البيبلوغرافية
العنوان: |
Maskless Lithography for High-Density Package Redistribution Layers |
المؤلفون: |
Murali, Prahalad, Nimbalkar, Pratik, Kathaperumal, Mohanalingam, Losego, Mark D., Tummala, Rao, Swaminathan, Madhavan |
المصدر: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :147-151 May, 2023 |
Relation: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |