التفاصيل البيبلوغرافية
| العنوان: |
Maskless Lithography for High-Density Package Redistribution Layers |
| المؤلفون: |
Murali, Prahalad, Nimbalkar, Pratik, Kathaperumal, Mohanalingam, Losego, Mark D., Tummala, Rao, Swaminathan, Madhavan |
| المصدر: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :147-151 May, 2023 |
| Relation: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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