التفاصيل البيبلوغرافية
العنوان: |
Electromigration Performance of Fine-Line Cu Redistribution Layer (RDL) for High-Density Fan-Out Packaging |
المؤلفون: |
Kwon, JiHye, Ju, JeongMin, Kim, SangHyuk, Sohn, EunSook, Khim, JinYoung |
المصدر: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1297-1302 May, 2023 |
Relation: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |