Electromigration Performance of Fine-Line Cu Redistribution Layer (RDL) for High-Density Fan-Out Packaging

التفاصيل البيبلوغرافية
العنوان:	Electromigration Performance of Fine-Line Cu Redistribution Layer (RDL) for High-Density Fan-Out Packaging
المؤلفون:	Kwon, JiHye, Ju, JeongMin, Kim, SangHyuk, Sohn, EunSook, Khim, JinYoung
المصدر:	2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1297-1302 May, 2023
Relation:	2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library