التفاصيل البيبلوغرافية
| العنوان: |
Enhancement of Ga - 21.5 In - 10 Sn Eutectic Alloy Based Thermal Interface Material Incorporating Cu Flake |
| المؤلفون: |
Kim, Jang Baeg, Kang, Dong Gil, Noh, Taejoon, Kim, Seahwan, Jung, Seung-Boo |
| المصدر: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1730-1734 May, 2023 |
| Relation: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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