Finite Element Simulation of Electromigration near Crack Tip under Electric Load

التفاصيل البيبلوغرافية
العنوان: Finite Element Simulation of Electromigration near Crack Tip under Electric Load
المؤلفون: Liu, Thomas Jin-Chee
المصدر: 2023 13th International Conference on Power, Energy and Electrical Engineering (CPEEE) Power, Energy and Electrical Engineering (CPEEE), 2023 13th International Conference on. :8-12 Feb, 2023
Relation: 2023 13th International Conference on Power, Energy and Electrical Engineering (CPEEE)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781665490146
9781665490139
DOI:10.1109/CPEEE56777.2023.10217564