مؤتمر
Rough Silver for Improved Lead-Frame Reliability
| العنوان: | Rough Silver for Improved Lead-Frame Reliability |
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| المؤلفون: | Ting, Fai-Lung, So, Ka-Kiu, Lo, Tsz-Chun, Wu, Wei-Gang, Rzeznik, Maria |
| المصدر: | 2023 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2023 China. :1-4 Jun, 2023 |
| Relation: | 2023 China Semiconductor Technology International Conference (CSTIC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350311006 9798350310993 |
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| DOI: | 10.1109/CSTIC58779.2023.10219212 |