مؤتمر
A Multi-Step Sraf to Improve Process Windows in Metal Layer
| العنوان: | A Multi-Step Sraf to Improve Process Windows in Metal Layer |
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| المؤلفون: | Wei, Wei, Zhu, Lu, Wang, Dan, Sun, Xiaoyan, Wang, Yue, Zhang, Yueyu, Liu, Jianzhong, Yu, Shiri |
| المصدر: | 2023 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2023 China. :1-4 Jun, 2023 |
| Relation: | 2023 China Semiconductor Technology International Conference (CSTIC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350311006 9798350310993 |
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| DOI: | 10.1109/CSTIC58779.2023.10219385 |