التفاصيل البيبلوغرافية
| العنوان: |
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits |
| المؤلفون: |
Vanna-Iampikul, Pruek, Zhu, Lingjun, Erdogan, Serhat, Kathaperumal, Mohanalingam, Agarwal, Ravi, Gupta, Ram, Rinebold, Kevin, Lim, Sung Kyu |
| المصدر: |
2023 60th ACM/IEEE Design Automation Conference (DAC) Design Automation Conference (DAC), 2023 60th ACM/IEEE. :1-6 Jul, 2023 |
| Relation: |
2023 60th ACM/IEEE Design Automation Conference (DAC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
