Hardware Security Assessment through Repair of Damaged Device

التفاصيل البيبلوغرافية
العنوان: Hardware Security Assessment through Repair of Damaged Device
المؤلفون: Sim, S. Y., Liu, Q., Kor, H. B., Gan, C. L.
المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023
Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350301649
تدمد:19461550
DOI:10.1109/IPFA58228.2023.10249101