التفاصيل البيبلوغرافية
العنوان: |
An Innovative High Resistance Via Defect Finding Methodology with Nano-probing on FIB Recess Sample and TEM Lamella |
المؤلفون: |
Nan, Siti Nurjatikesuma Che, Oung, Pey Fen, Lee, Chong Haw |
المصدر: |
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023 |
Relation: |
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
قاعدة البيانات: |
IEEE Xplore Digital Library |