التفاصيل البيبلوغرافية
| العنوان: |
Foreign Material Identification by FTIR Characterization with Novel FIB Lamella Preparation |
| المؤلفون: |
Lan, Guoyu, Otte, Rik, Goumans, Leon, Hsu, Andy, Roberts, Harry, Kung, Terry |
| المصدر: |
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-4 Jul, 2023 |
| Relation: |
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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