Defect Isolation of Functional Failed 3D NAND Device Memory Using Memory Tester and Test Bench with OBIRCH

التفاصيل البيبلوغرافية
العنوان:	Defect Isolation of Functional Failed 3D NAND Device Memory Using Memory Tester and Test Bench with OBIRCH
المؤلفون:	Lim, Yong Cheng, Gan, Yong Yang, Loke, Bee Chin
المصدر:	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-4 Jul, 2023
Relation:	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
قاعدة البيانات:	IEEE Xplore Digital Library