التفاصيل البيبلوغرافية
العنوان: |
A RTC-DG Method for Electrical-Thermal-Stress Analysis of 3-D Packages of Integrated Circuits with Micro-Fluidic Cooling |
المؤلفون: |
Pan, Ruiming, Zhang, Xuan, Li, Ping |
المصدر: |
2023 International Applied Computational Electromagnetics Society Symposium (ACES-China) Applied Computational Electromagnetics Society Symposium (ACES-China), 2023 International. :01-04 Aug, 2023 |
Relation: |
2023 International Applied Computational Electromagnetics Society Symposium (ACES-China) |
قاعدة البيانات: |
IEEE Xplore Digital Library |