A RTC-DG Method for Electrical-Thermal-Stress Analysis of 3-D Packages of Integrated Circuits with Micro-Fluidic Cooling

التفاصيل البيبلوغرافية
العنوان: A RTC-DG Method for Electrical-Thermal-Stress Analysis of 3-D Packages of Integrated Circuits with Micro-Fluidic Cooling
المؤلفون: Pan, Ruiming, Zhang, Xuan, Li, Ping
المصدر: 2023 International Applied Computational Electromagnetics Society Symposium (ACES-China) Applied Computational Electromagnetics Society Symposium (ACES-China), 2023 International. :01-04 Aug, 2023
Relation: 2023 International Applied Computational Electromagnetics Society Symposium (ACES-China)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781733509657
DOI:10.23919/ACES-China60289.2023.10250099