التفاصيل البيبلوغرافية
| العنوان: |
Research on Integrated Circuit Heat Dissipation Packaging Method Considering the Distribution of Thermal Characteristics |
| المؤلفون: |
Zhang, Zhiyong, Wang, Yupeng, Wang, Zixuan |
| المصدر: |
2023 IEEE International Conference on Sensors, Electronics and Computer Engineering (ICSECE) Sensors, Electronics and Computer Engineering (ICSECE), 2023 IEEE International Conference on. :490-497 Aug, 2023 |
| Relation: |
2023 IEEE International Conference on Sensors, Electronics and Computer Engineering (ICSECE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
