التفاصيل البيبلوغرافية
العنوان: |
Research on Integrated Circuit Heat Dissipation Packaging Method Considering the Distribution of Thermal Characteristics |
المؤلفون: |
Zhang, Zhiyong, Wang, Yupeng, Wang, Zixuan |
المصدر: |
2023 IEEE International Conference on Sensors, Electronics and Computer Engineering (ICSECE) Sensors, Electronics and Computer Engineering (ICSECE), 2023 IEEE International Conference on. :490-497 Aug, 2023 |
Relation: |
2023 IEEE International Conference on Sensors, Electronics and Computer Engineering (ICSECE) |
قاعدة البيانات: |
IEEE Xplore Digital Library |