مؤتمر
Research on Integrated Circuit Heat Dissipation Packaging Method Considering the Distribution of Thermal Characteristics
العنوان: | Research on Integrated Circuit Heat Dissipation Packaging Method Considering the Distribution of Thermal Characteristics |
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المؤلفون: | Zhang, Zhiyong, Wang, Yupeng, Wang, Zixuan |
المصدر: | 2023 IEEE International Conference on Sensors, Electronics and Computer Engineering (ICSECE) Sensors, Electronics and Computer Engineering (ICSECE), 2023 IEEE International Conference on. :490-497 Aug, 2023 |
Relation: | 2023 IEEE International Conference on Sensors, Electronics and Computer Engineering (ICSECE) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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