التفاصيل البيبلوغرافية
| العنوان: |
Comparative life cycle assessment of hybrid bonding and copper pillar die-to-wafer 3D integrations for sub-THz applications |
| المؤلفون: |
Roulleau, Lea, Vauche, Laura, Valorge, Olivier, Dubarry, Christophe, Cioccio, Lea Di |
| المصدر: |
2023 18th European Microwave Integrated Circuits Conference (EuMIC) Microwave Integrated Circuits Conference (EuMIC), 2023 18th European. :390-393 Sep, 2023 |
| Relation: |
2023 18th European Microwave Integrated Circuits Conference (EuMIC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
