RF Performances and De-Embedding Techniques of Passive Devices in 3D Homogeneous Integration at Sub-THz

التفاصيل البيبلوغرافية
العنوان: RF Performances and De-Embedding Techniques of Passive Devices in 3D Homogeneous Integration at Sub-THz
المؤلفون: Oliveira, A., Valorge, O., Dubarry, C., Roelens, Y., Zaknoune, M., Lugo-Alvarez, J.
المصدر: 2023 53rd European Microwave Conference (EuMC) Microwave Conference (EuMC), 2023 53rd European. :616-619 Sep, 2023
Relation: 2023 53rd European Microwave Conference (EuMC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9782874870729
DOI:10.23919/EuMC58039.2023.10290293