iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement

التفاصيل البيبلوغرافية
العنوان: iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement
المؤلفون: Zhao, Xueyan, Chen, Shijian, Qiu, Yihang, Li, Jiangkao, Huang, Zhipeng, Xie, Biwei, Li, Xingquan, Bao, Yungang
المصدر: 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) Computer Aided Design (ICCAD), 2023 IEEE/ACM International Conference on. :1-9 Oct, 2023
Relation: 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350322255
تدمد:15582434
DOI:10.1109/ICCAD57390.2023.10323811