مؤتمر
iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement
العنوان: | iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement |
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المؤلفون: | Zhao, Xueyan, Chen, Shijian, Qiu, Yihang, Li, Jiangkao, Huang, Zhipeng, Xie, Biwei, Li, Xingquan, Bao, Yungang |
المصدر: | 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) Computer Aided Design (ICCAD), 2023 IEEE/ACM International Conference on. :1-9 Oct, 2023 |
Relation: | 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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