مؤتمر
Thermally-Aware Multi-Core Chiplet Stacking
| العنوان: | Thermally-Aware Multi-Core Chiplet Stacking |
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| المؤلفون: | Kothari, Gaurav, Ghose, Kanad |
| المصدر: | 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) Computer Aided Design (ICCAD), 2023 IEEE/ACM International Conference on. :1-9 Oct, 2023 |
| Relation: | 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9798350322255 |
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| تدمد: | 15582434 |
| DOI: | 10.1109/ICCAD57390.2023.10323991 |