مؤتمر
Thermally-Aware Multi-Core Chiplet Stacking
| العنوان: | Thermally-Aware Multi-Core Chiplet Stacking |
|---|---|
| المؤلفون: | Kothari, Gaurav, Ghose, Kanad |
| المصدر: | 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) Computer Aided Design (ICCAD), 2023 IEEE/ACM International Conference on. :1-9 Oct, 2023 |
| Relation: | 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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