التفاصيل البيبلوغرافية
| العنوان: |
A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology |
| المؤلفون: |
Lee, Gwi-Deok Ryan, Kim, Dae-Hoon, Kwon, Doowon, Park, Jong-Eun, Cho, Dongseok, Kang, Jeongsoon, Park, Gyunha, Kang, Junha, Jang, Minho, Oh, Seungjae, Kim, Doyeon, Yoon, Sol, Kim, Yongjun, Park, Sejin, Lim, Kyungtae, Oh, Dongjun, Kang, SooYoung, Park, Keunhyoung, Kim, Changhwa, Kim, Hyoju, Kim, Taeyeong, Lee, Kyu-Ha, Cho, Hyoukyung, Hwang, Son-Kwan, Lee, Hojin, Lee, Jae-Kyu, Kim, Hyunchul, Moon, Chang-Rok, Song, Jaihyuk |
| المصدر: |
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023 |
| Relation: |
2023 International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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