التفاصيل البيبلوغرافية
العنوان: |
Two-metal-level semi-damascene interconnect at metal pitch 18 nm and aspect-ratio 6 routed using fully self-aligned via |
المؤلفون: |
Gupta, Anshul, Marti, Giulio, Delie, Gilles, Kundu, Souvik, Decoster, Stefan, Pedreira, Olalla Varela, Kenens, Bart, Farokhnejad, Anita, Hermans, Yannick, Wachter, Bart de, Gavrilov, Anton, Lesniewska, Alicja, Oniki, Yusuke, Pacco, Antoine, Murdoch, Gayle, Park, Seongho, Tokei, Zsolt |
المصدر: |
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023 |
Relation: |
2023 International Electron Devices Meeting (IEDM) |
قاعدة البيانات: |
IEEE Xplore Digital Library |