Two-metal-level semi-damascene interconnect at metal pitch 18 nm and aspect-ratio 6 routed using fully self-aligned via

التفاصيل البيبلوغرافية
العنوان: Two-metal-level semi-damascene interconnect at metal pitch 18 nm and aspect-ratio 6 routed using fully self-aligned via
المؤلفون: Gupta, Anshul, Marti, Giulio, Delie, Gilles, Kundu, Souvik, Decoster, Stefan, Pedreira, Olalla Varela, Kenens, Bart, Farokhnejad, Anita, Hermans, Yannick, Wachter, Bart de, Gavrilov, Anton, Lesniewska, Alicja, Oniki, Yusuke, Pacco, Antoine, Murdoch, Gayle, Park, Seongho, Tokei, Zsolt
المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Relation: 2023 International Electron Devices Meeting (IEDM)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350327670
تدمد:2156017X
DOI:10.1109/IEDM45741.2023.10413784