مؤتمر
Ultimate Layer Stacking Technology for High Density Sequential 3D Integration
| العنوان: | Ultimate Layer Stacking Technology for High Density Sequential 3D Integration |
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| المؤلفون: | Radu, I., Nguyen, B-Y., Chang, C-H., Neve, C. Roda, Gaudin, G., Besnard, G., Batude, P., Loup, V., Brunet, L., Vandooren, A., Horiguchi, N. |
| المصدر: | 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023 |
| Relation: | 2023 International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9798350327670 |
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| تدمد: | 2156017X |
| DOI: | 10.1109/IEDM45741.2023.10413807 |