مؤتمر
CMOS-Fabricated Ring Surface Ion Trap with TSV Integration
| العنوان: | CMOS-Fabricated Ring Surface Ion Trap with TSV Integration |
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| المؤلفون: | Zhao, Peng, Lim, Yu Dian, Li, Hongyu, Likforman, Jean-Pierre, Guidoni, Luca, Desormeaux, Lilay Gros, Tan, Chuan Seng |
| المصدر: | 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023 |
| Relation: | 2023 International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9798350327670 |
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| تدمد: | 2156017X |
| DOI: | 10.1109/IEDM45741.2023.10413875 |