مؤتمر
CMOS-Fabricated Ring Surface Ion Trap with TSV Integration
العنوان: | CMOS-Fabricated Ring Surface Ion Trap with TSV Integration |
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المؤلفون: | Zhao, Peng, Lim, Yu Dian, Li, Hongyu, Likforman, Jean-Pierre, Guidoni, Luca, Desormeaux, Lilay Gros, Tan, Chuan Seng |
المصدر: | 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023 |
Relation: | 2023 International Electron Devices Meeting (IEDM) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9798350327670 |
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تدمد: | 2156017X |
DOI: | 10.1109/IEDM45741.2023.10413875 |