مؤتمر
Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding
| العنوان: | Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding |
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| المؤلفون: | Scott, Travis |
| المصدر: | 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023 |
| Relation: | 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9780956808691 |
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| DOI: | 10.23919/EMPC55870.2023.10418272 |