التفاصيل البيبلوغرافية
| العنوان: |
Effect of Surface Microstructure on Joints Using Nanoporous Cu Sheet for Power Devices |
| المؤلفون: |
Nishikawa, Hiroshi, Park, Byungho, Saito, Mikiko, Mizuno, Jun |
| المصدر: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-4 Sep, 2023 |
| Relation: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
