التفاصيل البيبلوغرافية
| العنوان: |
Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver Sintering |
| المؤلفون: |
Gougeon, Julie, Feautrier, Celine, Souriau, Jean-Charles, Franiatte, Remi, Deschaseaux, Edouard, Mendizabal, Laurent, Treguer-Delapierre, Mona |
| المصدر: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-4 Sep, 2023 |
| Relation: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
