التفاصيل البيبلوغرافية
| العنوان: |
Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction |
| المؤلفون: |
Hassan, Sheikh, Rajaguru, Pushparajah, Stoyanov, Stoyan, Bailey, Christopher |
| المصدر: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023 |
| Relation: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
