التفاصيل البيبلوغرافية
| العنوان: |
Cu Pumping Analysis During $\text{Cu}/\text{SiO}_{2}$ Hybrid Bonding Using In-Situ SPM Imaging |
| المؤلفون: |
Roshanghias, Ali, Kaczynski, Jaroslaw, Hangen, Ude |
| المصدر: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-4 Sep, 2023 |
| Relation: |
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
