دورية أكاديمية
A Collective Die to Wafer Bonding Approach Based on Surface-Activated Aluminum–Aluminum Thermocompression Bonding
| العنوان: | A Collective Die to Wafer Bonding Approach Based on Surface-Activated Aluminum–Aluminum Thermocompression Bonding |
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| المؤلفون: | Schulze, S., VoB, T., Kruger, P., Wietstruck, M. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(3):519-524 Mar, 2024 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2024.3363236 |