دورية أكاديمية
A Collective Die to Wafer Bonding Approach Based on Surface-Activated Aluminum–Aluminum Thermocompression Bonding
العنوان: | A Collective Die to Wafer Bonding Approach Based on Surface-Activated Aluminum–Aluminum Thermocompression Bonding |
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المؤلفون: | Schulze, S., VoB, T., Kruger, P., Wietstruck, M. |
المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(3):519-524 Mar, 2024 |
قاعدة البيانات: | IEEE Xplore Digital Library |
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