دورية أكاديمية
Bottom-Up SAW Resonator Design for Single-Stage Glass Frit Bonding at Chip-Level
| العنوان: | Bottom-Up SAW Resonator Design for Single-Stage Glass Frit Bonding at Chip-Level |
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| المؤلفون: | Pfeifer, F., Bronner, A., Seiferling, F., Wilde, J. |
| المصدر: | IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(6):7625-7635 Mar, 2024 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 1530437X 15581748 23799153 |
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| DOI: | 10.1109/JSEN.2024.3361528 |