Through-Silicon Isolation Based on Dry Filling and Reflow of Micron Glass Powders

التفاصيل البيبلوغرافية
العنوان:	Through-Silicon Isolation Based on Dry Filling and Reflow of Micron Glass Powders
المؤلفون:	Zhou, Wenduan, Ling, Biyun, Chen, Dong, Xu, Qiao, Xia, Yuhu, Cai, Minli, Wu, Yaming
المصدر:	2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :697-700 Jan, 2024
Relation:	2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)
قاعدة البيانات:	IEEE Xplore Digital Library