التفاصيل البيبلوغرافية
| العنوان: |
TCF-Tailoring Vertically Stepped Structures for Temperature Insensitive CMOS-MEMS Resonators |
| المؤلفون: |
Lan, Kai-Wei, Chung, I-Fei, Tsai, Chun-Pu, Chen, Ting-Yi, Li, Wei-Chang |
| المصدر: |
2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :140-143 Jan, 2024 |
| Relation: |
2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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