مؤتمر
VIE-DDM Based PEEC Method with Parallel Technology for DC Analysis of Packaging Circuit
| العنوان: | VIE-DDM Based PEEC Method with Parallel Technology for DC Analysis of Packaging Circuit |
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| المؤلفون: | Zhou, Tao, Cai, Qiang-Ming, Li, Yixiang, Cao, Xin, Du, Zhenyong, Fan, Jun |
| المصدر: | 2023 Asia-Pacific Microwave Conference (APMC) Microwave Conference (APMC), 2023 Asia-Pacific. :456-458 Dec, 2023 |
| Relation: | 2023 Asia-Pacific Microwave Conference (APMC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781665494182 |
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| DOI: | 10.1109/APMC57107.2023.10439934 |