التفاصيل البيبلوغرافية
| العنوان: |
Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration |
| المؤلفون: |
Wang, Xiangyu, Rotaru, Mihai Dragos, Haitao, Yu, Jonq, Mingchinq, Chong, Chai Tai, Chui, King-Jien |
| المصدر: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :116-119 Dec, 2023 |
| Relation: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
